? semiconductor components industries, llc, 2011 march, 2011 ? rev. 0 1 publication order number: ESD1014/d ESD1014 low capacitance esd protection array for high speed data lines protection the ESD1014 transient voltage suppressor is designed to protect high speed data lines from esd, eft, and lightning. features ? low capacitance (6 pf maximum between i/o lines and gnd) ? esd rating of class 3b (exceeding 8 kv) per human body model and class c (exceeding 400 v) per machine model ? protection for the following iec standards: iec 61000 ? 4 ? 2 (esd) level 4 ? 30 kv (contact) ? this is a pb ? free device typical applications ? high speed communication line protection ? usb 1.1 and 2.0 power and data line protection ? digital video interface (dvi) ? monitors and flat panel displays ? t1/e1 and t3/e3 maximum ratings (t j = 25 c unless otherwise noted) rating symbol value unit peak power dissipation p pk 450 w maximum peak pulse current 8 x 20 s @ t a = 25 c i pp 25 a operating junction temperature range t j ? 40 to +125 c storage temperature range t stg ? 55 to +150 c lead solder temperature ? maximum (10 seconds) t l 260 c human body model (hbm) machine model (mm) iec 61000 ? 4 ? 2 contact (esd) esd 16000 400 30000 v stresses exceeding maximum ratings may damage the device. maximum ratings are stress ratings only. functional operation above the recommended operating conditions is not implied. extended exposure to stresses above the recommended operating conditions may affect device reliability. low capacitance diode tvs array marking diagram device package shipping ? ordering information udfn10 case 517an pin configuration and schematic http://onsemi.com ESD1014mutag udfn10 (pb ? free) 3000/tape & reel ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our tape and reel packaging specification brochure, brd8011/d. 1014 = specific device code a = assembly location y = year w = work week = pb ? free package 10 9 8 7 6 1 2 3 4 5 1014 ayw
ESD1014 http://onsemi.com 2 electrical characteristics (t a =25 c unless otherwise specified) parameter symbol conditions min typ max unit reverse working voltage v rwm (note 1) 3.3 v breakdown voltage v br i t =1 ma, (note 2) 5.0 5.3 v reverse leakage current i r v rwm = 3.3 v 5.0 a clamping voltage v c i pp = 1 a 7.5 v clamping voltage v c i pp = 10 a 9.0 v clamping voltage v c i pp = 25 a 11 v maximum peak pulse current i pp 8x20 s waveform 25 a junction capacitance c j v r = 0 v, f=1 mhz between i/o pins and gnd 3.8 6.0 pf junction capacitance c j v r = 0 v, f=1 mhz between i/o pins 1.5 3.0 pf 1. tvs devices are normally selected according to the working peak reverse voltage (v rwm ), which should be equal or greater than the dc or continuous peak operating voltage level. 2. v br is measured at pulse test current i t . typical performance curves (t j = 25 c unless otherwise noted) 100 90 80 70 60 50 40 30 20 10 0 0 25 50 75 100 125 150 175 200 t a , ambient temperature ( c) figure 1. pulse derating curve 100 90 80 70 60 50 40 30 20 10 0 0204060 t, time ( s) % of peak pulse current t p t r pulse width (t p ) is defined as that point where the peak current decay = 8 s peak value i rsm @ 8 s half value i rsm /2 @ 20 s 80 peak power dissipation (%) figure 2. 8 20 s pulse waveform
ESD1014 http://onsemi.com 3 package dimensions udfn10 2.6x2.6, 0.5p case 517an ? 01 issue o notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: millimeters. 3. dimension b applies to plated terminal and is measured between 0.15 and 0.30mm from terminal. 4. coplanarity applies to the exposed pad as well as the terminals. c a seating plane d e 0.10 c a3 a a1 2x 2x 0.10 c dim a min max millimeters 0.45 0.55 a1 0.00 0.05 a3 0.127 ref b 0.20 0.30 d 2.60 bsc d2 2.00 2.25 e 2.60 bsc 1.11 1.36 e2 e 0.50 bsc k pin one reference 0.08 c 0.10 c 10x a 0.10 c note 3 l e d2 e2 b b 5 6 10x 1 k 10 10x 10x 0.05 c 0.30 0.40 l *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* 2.25 1.42 0.50 0.58 10x 2.90 0.30 10x dimensions: millimeters top view side view bottom view b note 4 0.20 --- pitch on semiconductor and are registered trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to mak e changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for an y particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/or specifications can and do vary in different application s and actual performance may vary over time. all operating parameters, including ?typicals? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a sit uation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indemnify and hold scillc and its of ficers, employees, subsidiaries, af filiates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. publication ordering information n. american technical support : 800 ? 282 ? 9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81 ? 3 ? 5773 ? 3850 ESD1014/d literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303 ? 675 ? 2175 or 800 ? 344 ? 3860 toll free usa/canada fax : 303 ? 675 ? 2176 or 800 ? 344 ? 3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your local sales representative
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